JPS633455B2 - - Google Patents

Info

Publication number
JPS633455B2
JPS633455B2 JP16958383A JP16958383A JPS633455B2 JP S633455 B2 JPS633455 B2 JP S633455B2 JP 16958383 A JP16958383 A JP 16958383A JP 16958383 A JP16958383 A JP 16958383A JP S633455 B2 JPS633455 B2 JP S633455B2
Authority
JP
Japan
Prior art keywords
semiconductor wafer
receiving
wafer
rotating frame
cassette
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16958383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6059747A (ja
Inventor
Takeshi Sakashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16958383A priority Critical patent/JPS6059747A/ja
Publication of JPS6059747A publication Critical patent/JPS6059747A/ja
Publication of JPS633455B2 publication Critical patent/JPS633455B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP16958383A 1983-09-12 1983-09-12 半導体ウエ−ハの処理装置 Granted JPS6059747A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16958383A JPS6059747A (ja) 1983-09-12 1983-09-12 半導体ウエ−ハの処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16958383A JPS6059747A (ja) 1983-09-12 1983-09-12 半導体ウエ−ハの処理装置

Publications (2)

Publication Number Publication Date
JPS6059747A JPS6059747A (ja) 1985-04-06
JPS633455B2 true JPS633455B2 (en]) 1988-01-23

Family

ID=15889166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16958383A Granted JPS6059747A (ja) 1983-09-12 1983-09-12 半導体ウエ−ハの処理装置

Country Status (1)

Country Link
JP (1) JPS6059747A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821566B2 (ja) * 1986-07-18 1996-03-04 関西日本電気株式会社 半導体ウエ−ハの洗浄方法
JPH073634Y2 (ja) * 1987-12-28 1995-01-30 株式会社トムコ ウェハ液洗乾燥装置
CN111092036B (zh) * 2020-03-23 2020-07-14 杭州众硅电子科技有限公司 一种晶圆清洗干燥装置

Also Published As

Publication number Publication date
JPS6059747A (ja) 1985-04-06

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